[1]程 磊,田丽芳.基于无损探伤的高精度电路板缺陷检测系统[J].江西师范大学学报(自然科学版),2016,40(04):400-403.
 CHENG Lei,TIAN Lifang.The High-Precision Non-Destructive Inspection Detection System for Circuit Board Defect[J].Journal of Jiangxi Normal University:Natural Science Edition,2016,40(04):400-403.
点击复制

基于无损探伤的高精度电路板缺陷检测系统()
分享到:

《江西师范大学学报》(自然科学版)[ISSN:1006-6977/CN:61-1281/TN]

卷:
40
期数:
2016年04期
页码:
400-403
栏目:
出版日期:
2016-09-01

文章信息/Info

Title:
The High-Precision Non-Destructive Inspection Detection System for Circuit Board Defect
作者:
程 磊田丽芳
1.黄淮学院电子科学与工程系,河南 驻马店 463000; 2.黄淮学院信息工程学院,河南 驻马店 463000
Author(s):
CHENG LeiTIAN Lifang
1.Department of Electronic Science and Engineering,Huanghuai University,Zhumadian Henan 463000,China; 2.Department of Information Engineering,Huanghuai University,Zhumadian Henan 463000,China
关键词:
无损探伤 缺陷检测 高精度 累计采样降噪算法
Keywords:
NDT defect detection high-precision cumulative sampling noise reduction algorithm
分类号:
TP 274
文献标志码:
A
摘要:
为了实现电路板焊盘、焊点焊接情况的快速缺陷分析,采用无损探伤技术结合大比例成像结构设计了高精度电路板缺陷检测系统.系统由X射线机、MV-M1000型高分辨率图像采集卡以及MN39750PA型CCD探测器构成,在分析了无损探伤基本原理的基础上,设计了大比例电路板成像结构,并提出了累计采样降噪算法.针对存在焊接问题的电路板进行实验,实验结果显示:通过无损探伤系统可以清楚地观察电路板的焊接情况.经光学系统计算分析可知,对缺陷的检测精度可达30 μm,可以有效地满足工业应用等的设计要求.
Abstract:
In order to accurately obtain joints defects information of the circuit board pads,solder in any cases,high-precision nondestructive testing system is designed.The system consists of an X-ray machine,MV-M1000 high-resolution image acquisition card and MN39750PA type CCD detector composition.After analyzing the basic principle of non-destructive testing, a large proportion of the circuit board imaging structure is designed.Cumulative sampling noise reduction algorithm was proposed.Problems for the existing circuit board welding experiment.Experimental results show that,soldering the circuit board can be clearly observed in the case of non-destructive testing system.Calculated by the optical system analysis,the defect detection accuracy 30μm can effectively meet the design requirements of industrial applications.

参考文献/References:

[1] 王格芳,庞郁,沙晓光,等.神经网络在电路板无损检测系统中的应用 [J].仪器仪表学报,2005,(S1):18-19.
[2] 董昌灏,童莉,曾磊,等.基于改进Graph Cuts的印刷电路板CT图像分割算法 [J].信息工程大学学报,2013,1(1):71-75.
[3] 王汪,谭辉,黄亮,等.高能X射线成像装置数据采集与传输系统设计 [J].核电子学与探测技术,2008,28(6):1087-1090.
[4] Mardina Abdullah,Hal J Strangeways,David M A Walsh.Effects of ionospheric horizontal gradients on differential GPS [J].Acta Geophysica,2007,55(4):509-523.
[5] 曲肇文,王明泉,王玉.高分辨力印制电路板X射线检测系统 [J].无损检测,2010,6(1):43-45.
[6] 罗锋华,文方.信息融合技术在电路板无损检测中的应用研究 [J].制造业自动化,2010,1(1):28-30.
[7] 李勇,罗锋华.基于信息融合技术的电路板无损检测 [J].煤炭技术,2009,11(1):43-44.
[8] Bulusu N,Heidemann J,Estrin D.GPS-less low cost outdoor localization for very small device [J].IEEE Personal Communications,2000,7(5):28-34.
[9] 杜宣燕,潘玉田,刘智超.基于图像采集卡的高分辨率X射线检测系统设计 [J].传感器与微系统,2011,6(1):113-115.
[10] 刘伟,周轶然.X射线衍射仪故障与维修实例 [J].现代科学仪器,2010,5(1):145-146.
[11] Mazzaferri J,Ledesma S.Wavelet coefficients thresholding method applied to the correlation of noisy scenes [J].Processing of SPIE,2004,5622:617-621.
[12] 谢宏威,张宪民,邝咏聪,等.印刷电路板焊点的智能检测 [J].光学精密工程,2011,19(9):2154-2162.
[13] 刘杰,崔成旺.印刷电路板的功能检测 [J].煤炭技术,2012,31(4):76-77.
[14] 乔维维,秦小文,杨冈.图像分割技术用于印刷电路板检测的研究 [J].山西电子技术,2011(3):87-89.
[15] 张文,方飞.基于采集点的高分辨X射线检测系统 [J].核电子学与探测技术,2010,30(10):1404-1407.

备注/Memo

备注/Memo:
收稿日期:2016-02-17基金项目:河南省科技厅重点攻关计划(132102210523)资助项目.作者简介:程 磊(1981-),女,湖北黄梅人,讲师,主要从事电子应用技术和计算机自动控制等研究.
更新日期/Last Update: 1900-01-01